ECK30-T13IA2MN2M-I Embedded core board Cost-effective multi-core processor Dual-core ARM Cortex-A7 RISC-V HiFi4 DSP
[Processor model]：T113-i
[Processor frequency]：1.2GHz
[Memory capacity]：256MB
[Storage capacity]：256MB
[Product size]：45*35*3.6mm
[Product weight]：15±1g
[Introduction]：Ebyte ECK30-T13IA series core board is carefully designed based on Allwinner's T113-i processor. It is a low-cost, low-power, cost-effective, and highly reliable industrial-grade embedded core board with stamp hole connection. It can be widely used in industrial control, HMI, IoT and other fields.
Official Store| Industrial Computing | Processor Model | Processor FrequencyHz | Memory CapacityMB | Storage CapacityMB | Operating VoltageV | Interface Type | Sizemm | Operating Temperature°C | Features | Manual | Sample |
|---|---|---|---|---|---|---|---|---|---|---|---|
| ECK31-T13SA2ME8G | T113-S4 | 1.2G | 256 | 8GB | 5 | Stamp Hole | 35*29*3.0 | -25 - 85 | Made-in China, T113-S Core Board ,Supports Linux, Supports QT | ||
| ECK31-T13SA2MN2M | T113-S4 | 1.2G | 256 | 256 | 5 | stamp hole | 35*29*3.0 | -25-85 | Made-in China, T113-S Core Board ,Supports Linux, Supports QT | ||
| ECK31-T13SA1ME8G | T113-S3 | 1.2G | 128 | 8GB | 5 | Stamp Hole | 35*29*3.0 | -25 - 85 | Made-in China, T113-S Core Board ,Supports Linux, Supports QT | ||
| ECK31-T13SA1MN2M | T113-S3 | 1.2G | 128 | 256 | 5 | Stamp Perforation | 35*29*3.0 | -25 - 85 | Made-in China, T113-S Core Board ,Supports Linux, Supports QT | ||
| ECK33-BCE2E16-I | T536MX-CEX | 1.6G | 2GB | 16GB | 5 | LGA | 45*43*3.5 | -40~+85 | ECC protection, LPDDR4 memory, industrial-grade, and Linux support. | ||
| ECK33-B2N4E32-I | T536MX-CEN2 | 1.6G | 4GB | 32GB | 5 | LGA | 45*43*3.5 | -40~+85 | multi-core heterogeneous ARM+RISC-V,industrial-grade, Linux support | ||
| ECK30-T13IC1E8-I | T113-i | 1.2G | 1G | 8GB | 5 | BTB | 46*36*5.3 | -40~85 | Industrial-grade,multi-core heterogeneous architecture, cost-effective | ||
| ECK30-T13IC5E8-I | T113-i | 1.2G | 512 | 8GB | 5 | BTB | 46*36*5.3 | -40~85 | Industrial-grade,multi-core heterogeneous architecture, cost-effective | ||
| ECK30-T13IC2N2-I | T113-i | 1.2G | 256 | 256 | 5 | BTB | 46*36*5.3 | -40~85 | Industrial-Grade,Multi-Core Heterogeneous, High Cost-Effectiveness | ||
| ECK32-T527B4E32-N | T527M/MN | 1.8G | 4GB | 32GB | 5 | LGA | 45*43*3.5 | -25~85 | High-performance octa-core A55, integrated GPU, multi-core heterogeneous ARM+RISC-V | ||
| ECK32-T527B2E16-I | T527M/MN | 1.8G | 2GB | 16GB | 5 | LGA | 45*43*3.5 | -40~85 | High-performance octa-core A55 processor, integrated GPU,cost-effective, Linux compatible | ||
| ECK32-T527BN4E32-N | T527M/MN | 1.8G | 4GB | 32GB | 5 | LGA | 45*43*3.5 | -25~85 | integrated GPU, multi-core heterogeneous ARM+RISC-V, LPDDR4 memory,Linux support | ||
| ECK32-T527BN4E32-I | T527M/MN | 1.8G | 4GB | 32GB | 5 | LGA | 45*43*3.5 | -40~85 | High-performance octa-core A55, 2TOPS AI NPU, integrated GPU | ||
| ECK30-T13IA1GE8G-I | T113-i | 1.2G | 1GB | 8GB | 5 | Stamp hole | 45*35*3.6 | -40℃-85 | Industrial grade, dual-core ARM+RISC-V,high reliability, support Linux, support QT | ||
| ECK30-T13IA5ME8G-I | T113-i | 1.2G | 1GB | 8GB | 5 | Stamp hole | 45*35*3.6 | -40℃-85 | Industrial grade, dual-core ARM+RISC-V, high-definition display | ||
| ECK30-T13IA2MN2M-I | T113-i | 1.2G | 256 | 256 | 5 | Stamp hole | 45×35×3.6 | -40℃-85 | industrial grade, dual-core ARM+RISC-V,support Linux, support QT |