[Interface]:Type-C
[Size]:30*85mm
[Introduction]:The SC series evaluation kit is designed to help users quickly evaluate Ebyte's new generation of package-compatible wireless modules. The MCU uses STM32F103C8T6, and the available pins are all brought out to the pin headers on both sides. Developers can connect a variety of peripherals according to their needs to facilitate secondary development. The kit provides complete software application examples to help customers get started quickly. Different types of Sub-1G wireless modules can be mounted on board according to needs. The supported modules have pin-compatible packages and can be quickly replaced.
| Pin number | definition | Functional Description |
| 1 | GND | Chassis ground wire |
| 2 | PA2 | MCU_PA2 Pin |
| 3 | PA1 | MCU_PA1 pin |
| 4 | PA0 | MCU_PA0 pin |
| 5 | PB8 | MCU_PB8 Pins |
| 6 | VBAT | MCU_VBAT pin |
| 7 | PC13 | MCU_PC13 Pinout |
| 8 | GND | Chassis ground wire |
| 9 | GND | Chassis ground wire |
| 10 | +5V | 5V power supply interface |
| 11 | GND | Chassis ground wire |
| 12 | 3.3V | 3.3V power supply interface |
| 13 | CLK | SWCLK |
| 14 | PART | SWEDING |
| 15 | GND | Chassis ground wire |
| 16 | RXD | MCU_RXD data input pin |
| 17 | TXD | MCU_TXD data output pin |
| 18 | PA8 | MCU_PA8 pin |
| 19 | PB15 | MCU_PB15 Pinout |
| 20 | PB14 | MCU_PB14 Pinout |