E291-400MBL-SC(3120) Offline testing and evaluation kit Pre-soldered E291-400M20S(3120) module
[Interface]：Type-C
[Chip]：PAN3120
[Size]：30*74mm
[Introduction]：The SC series evaluation kit is designed to help users quickly evaluate EBYTE's next-generation package-compatible wireless modules. The MCU uses the STM32F103C8T6, with all available pins brought out to the side headers. Developers can easily connect various peripheral devices via jumpers according to their needs, facilitating secondary development.
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| Pin number | definition | Function Description |
| 1 | GND | Base plate ground wire |
| 2 | PA2 | MCU_PA2 pin |
| 3 | PA1 | MCU_PA1 pin |
| 4 | PA0 | MCU_PA0 pin |
| 5 | PB8 | MCU_PB8 pin |
| 6 | VBAT | MCU_VBAT pin |
| 7 | PC13 | MCU_PC13 pin |
| 8 | GND | Base plate ground wire |
| 9 | GND | Base plate ground wire |
| 10 | +5V | 5V power supply interface |
| 11 | GND | Base plate ground wire |
| 12 | 3.3V | 3.3V power supply interface |
| 13 | CLK | SWCLK |
| 14 | PART | SWEDING |
| 15 | GND | Base plate ground wire |
| 16 | RXD | MCU_RXD data input pin |
| 17 | TXD | MCU_TXD data output pin |
| 18 | PA8 | MCU_PA8 pin |
| 19 | PB15 | MCU_PB15 pin |
| 20 | PB14 | MCU_PB14 pin |