E290-400MBL-SC(3060) LoRa module development board Soldered E290-400M20S module
[Interface]：Type-C
[Chip Solution]：PAN3060
[Size]：30*64mm
[Introduction]：The SC series evaluation kit is designed to help users quickly evaluate Ebyte's next-generation footprint-compatible wireless modules. This development kit incorporates the E290-400M20S series ChirpIoT™ spread spectrum module, featuring the PAN3060 chip. It can be equipped with various Sub-1G wireless modules based on customer needs. Supported modules all have pin-compatible footprints, enabling quick interchangeability.
Official Store| Module | Interface | IC | Frequency | Power | Rangekm | Communication protocol | Antenna form | Sizemm | Features | Manual | Sample |
|---|---|---|---|---|---|---|---|---|---|---|---|
| E290-400MBH-SC(3029) | Type-C | PAN3029 | - | - | - | - | - | 30*85 | Soldered E290-400M30S (3029) ChirpIoT™ extended spectrum module, Sub-1G evaluation kit | ||
| E290-400MBL-SC(3060) | Type-C | PAN3060 | - | - | - | - | - | 30*64 | Evaluation kit for the domestically produced ChirpIoT™ extended spectrum module, using the E290-400M20S (3060) soldered on. | ||
| E290-400MBL-SC(3029) | Type-C | PAN3029 | - | - | - | - | - | 30*64 | Soldering the E290-400M20S (3029) next-generation Chinese ChirpIoT™ spread spectrum module, Sub-1G evaluation kit | ||
| E290-400MBH-SC(3060) | Type-C | PAN3060 | - | - | - | - | - | 30*85 | Soldering the E290-400M30S series domestic ChirpIoT™ spread spectrum module, Sub-1G wireless module evaluation kit |