[Interface]:Type-C
[Chip Solution]:PAN3060
[Size]:30*64mm
[Introduction]:The SC series evaluation kit is designed to help users quickly evaluate Ebyte's next-generation footprint-compatible wireless modules. This development kit incorporates the E290-400M20S series ChirpIoT™ spread spectrum module, featuring the PAN3060 chip. It can be equipped with various Sub-1G wireless modules based on customer needs. Supported modules all have pin-compatible footprints, enabling quick interchangeability.
| Pin number | definition | Functional Description |
| 1 | GND | Chassis ground wire |
| 2 | PA2 | MCU_PA2 pin |
| 3 | PA1 | MCU_PA1 pin |
| 4 | PA0 | MCU_PA0 pin |
| 5 | PB8 | MCU_PB8 pin |
| 6 | VBAT | MCU_VBAT pin |
| 7 | PC13 | MCU_PC13 pin |
| 8 | GND | Chassis ground wire |
| 9 | GND | Chassis ground wire |
| 10 | +5V | 5V power supply interface |
| 11 | GND | Chassis ground wire |
| 12 | 3.3V | 3.3V power supply interface |
| 13 | CLK | SWCLK |
| 14 | PART | SWEDING |
| 15 | GND | Chassis ground wire |
| 16 | RXD | MCU_RXD data input pin |
| 17 | TXD | MCU_TXD data output pin |
| 18 | PA8 | MCU_PA8 pin |
| 19 | PB15 | MCU_PB15 pin |
| 20 | PB14 | MCU_PB14 pin |