[Interface]： Type-C

[Chip]：PAN3060

[Size]：30*85mm

[Introduction]：The SC series evaluation kit is designed to help users quickly evaluate Ebyte's new generation of package-compatible wireless modules. This development test board uses the EWM290-400M30S series of domestically produced ChirpIoT™ spread spectrum modules based on the PAN3060 chip solution. The MCU uses the STM32F103C8T6, and the available pins are all brought out to the pin headers on both sides. Developers can easily connect a variety of peripheral devices through jumpers according to actual needs, facilitating secondary development. The kit provides complete software application examples to help customers quickly get started with wireless data communication development. Different types of Sub-1G wireless modules can be installed on board according to customer needs. Supported modules all have pin-compatible packages and can be quickly replaced.