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E22P-868MBH-SC E22 Test Evaluation Kit Pre-welded E22P-868M30S modules

[Interface]:Type-C

[Size]:30*85mm

[Introduction]:The SC series evaluation kit is designed to help users quickly evaluate Ebyte's next-generation wireless modules in compatible footprints. This kit utilizes the STM32F103C8T6 microcontroller, with all available pins broken out to two pin headers for easy development. The kit also includes complete software application examples to help customers quickly get started with wireless data communication development. The kit includes various Sub-1G wireless modules.

ModuleInterfaceICFrequencyPowerRangekmCommunication protocolAntenna formSizemmFeaturesManualSample
E22P-433MBH-SC Type-C - - - - - - 30*85 Sub-1G Wireless Module Evaluation Kit Soldering E22P-433M30S
EWT226-900H30S Type-C - - - - - - 70*36 EWM226-900H30S Lawn Mower LoRa Wireless Module Test Kit
EWT22A-900BWL22S Type-C - - - - - - 65*30 EWM22A-900BWL22S All-in-one Wireless Module Test Kit
EWT22A-400BWL22S Type-C - - - - - - 65*30 EWM22A-400BWL22S All-in-one Wireless Module Test Kit
E22P-915MBH-SC Type-C - - - - - - 30*85 E22 Test Evaluation Kit Pre-welded E22P-915M30S modules
E22P-868MBH-SC Type-C - - - - - - 30*85 E22 Test Evaluation Kit Pre-welded E22P-868M30S modules
E22-900TBH-SC Type-C - - - - - - 30*85 Soldering E22-900T30S, a new generation of package-compatible Sub-1G wireless module evaluation kit
E22-400TBH-SC Type-C - - - - - - 30*85 Soldering E22-400T30S, a new generation of package-compatible Sub-1G wireless module evaluation kit
E22-900MBH-SC Type-C - - - - - - 30*85 Soldering E22-900M30S, a new generation of package-compatible Sub-1G wireless module evaluation kit
E22-400MBH-SC Type-C LLCC68 - - - - - 30*85 Soldering E220-400M30S, a new generation of package-compatible Sub-1G wireless module evaluation kit
E22-900TBL-SC Type-C - - - - - - 30*68 Soldering E22-900T22S, a new generation of package-compatible Sub-1G wireless module evaluation kit
E22-400TBL-SC Type-C - - - - - - 30*68 Soldering E22-400T22S, a new generation of package-compatible Sub-1G wireless module evaluation kit
E22-900MBL-SC Type-C - - - - - - 30*64 Welded E22-900M22S, a new generation of package compatible Sub-1G wireless module evaluation kit
E22-400MBL-SC Type-C - - - - - - 30*64 Soldering E22-400M22S, a new generation of package-compatible Sub-1G wireless module evaluation kit
E22-400TBH-02 USB - - - - - - 59.5*97 E22-400T37S module development test board
E22-400MBL-01 USB - - - - - - 53*27 E22-400M22S Development Evaluation Kit
E22-900MBL-01 USB - - - - - - 53*27 E22 series module test board
E22-400TBL-01 USB - - - - - - 58*28 E22 series module test board
E22-400TBH-01 USB - - - - - - 80*45 E22 series module test board
E22-230TBL-01 USB - - - - - - 58*28 E22 series module test board
E22-230TBH-01 USB - - - - - - 80*45 E22 series module test board
E22-900TBL-01 USB - - - - - - 58*28 E22 series module test board
E22-900TBH-01 USB - - - - - - 80*45 E22 series module test board
E22P-433M30S-SC - - - - - - - -