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E22P-868MBH-SC E22 Test Evaluation Kit Pre-welded E22P-868M30S modules

[Interface]:Type-C

[Size]:30*85mm

[Introduction]:The SC series evaluation kit is designed to help users quickly evaluate Ebyte's next-generation wireless modules in compatible footprints. This kit utilizes the STM32F103C8T6 microcontroller, with all available pins broken out to two pin headers for easy development. The kit also includes complete software application examples to help customers quickly get started with wireless data communication development. The kit includes various Sub-1G wireless modules.

PIN

Pin number

definition

Functional Description

1

GND

Chassis ground wire

2

PA2

MCU_PA2 pin

3

PA1

MCU_PA1 pin

4

PAO

MCU_PA0 pin

5

PB8

MCU_PB8 pin

6

VBAT

MCU_VBAT pin

7

PC13

MCU_PC13pin

8

GND

Chassis ground wire

9

GND

Chassis ground wire

10

+5V

5V power supply interface

11

GND

Chassis ground wire

12

3.3V

3.3V power supply interface

13

CLK

SWCLK

14

DIO

SWDIO

15

GND

Chassis ground wire

16

RXD

MCU_RXD data input pin

17

TXD

MCU_TXD data output pin

18

PA8

MCU_PA8 pin

19

PB15

MCU_PB15pin

20

PB14

MCU_PB14pin