[Interface]：Type-C

[Chip]： SX1262

[Dimensions]：30*85mm

[Introduction]：The SC series evaluation kit is designed to help users quickly evaluate EBB's next-generation package-compatible wireless modules. This kit includes a soldered E22P-433M30S high-performance LoRa RF module. The MCU uses an STM32F103C8T6, and all available pins are brought out to the side headers for easy secondary development. The kit provides complete software application examples to help customers quickly get started with wireless data communication development.