[Interface]：Type-C

[Chip]：LLCC68

[Size]：30*85mm

[Introduction]：The SC series kit is designed for users to quickly evaluate Ebyte's new generation of package-compatible wireless modules. This development test board is soldered with the lora module of the E220-400M30S series LLCC68 chip. The MCU uses the STM32F103C8T6, and the available pins have been led out to the pin headers on both sides to facilitate developers to carry out secondary development. The kit provides complete software application examples to help customers quickly get started with wireless data communication development. Different types of Sub-1G wireless modules can be mounted on the board according to customer needs.