Ebyte OEM/ODM E22-900MBL-01 high power wireless module LoRa kits development board evaluation kit
[Interface]：USB
[Size]：53*27mm
[Function]：E22-900M22S Development Evaluation Kit
[Introduction]：The MBL series evaluation kits are designed to help users quickly evaluate Ebyte's new generation package compatible wireless modules.
Official Store| Module | Interface | IC | Frequency | Power | Rangekm | Communication protocol | Antenna form | Sizemm | Features | Manual | Sample |
|---|---|---|---|---|---|---|---|---|---|---|---|
| EWT22A-900BWL22S | Type-C | - | - | - | - | - | - | 65*30 | EWM22A-900BWL22S All-in-one Wireless Module Test Kit | ||
| EWT22A-400BWL22S | Type-C | - | - | - | - | - | - | 65*30 | EWM22A-400BWL22S All-in-one Wireless Module Test Kit | ||
| E22P-915MBH-SC | Type-C | - | - | - | - | - | - | 30*85 | E22 Test Evaluation Kit Pre-welded E22P-915M30S modules | ||
| E22P-868MBH-SC | Type-C | - | - | - | - | - | - | 30*85 | E22 Test Evaluation Kit Pre-welded E22P-868M30S modules | ||
| E22-900TBH-SC | Type-C | - | - | - | - | - | - | 30*85 | Soldering E22-900T30S, a new generation of package-compatible Sub-1G wireless module evaluation kit | ||
| E22-400TBH-SC | Type-C | - | - | - | - | - | - | 30*85 | Soldering E22-400T30S, a new generation of package-compatible Sub-1G wireless module evaluation kit | ||
| E22-900MBH-SC | Type-C | - | - | - | - | - | - | 30*85 | Soldering E22-900M30S, a new generation of package-compatible Sub-1G wireless module evaluation kit | ||
| E22-400MBH-SC | Type-C | LLCC68 | - | - | - | - | - | 30*85 | Soldering E220-400M30S, a new generation of package-compatible Sub-1G wireless module evaluation kit | ||
| E22-900TBL-SC | Type-C | - | - | - | - | - | - | 30*68 | Soldering E22-900T22S, a new generation of package-compatible Sub-1G wireless module evaluation kit | ||
| E22-400TBL-SC | Type-C | - | - | - | - | - | - | 30*68 | Soldering E22-400T22S, a new generation of package-compatible Sub-1G wireless module evaluation kit | ||
| E22-900MBL-SC | Type-C | - | - | - | - | - | - | 30*64 | Welded E22-900M22S, a new generation of package compatible Sub-1G wireless module evaluation kit | ||
| E22-400MBL-SC | Type-C | - | - | - | - | - | - | 30*64 | Soldering E22-400M22S, a new generation of package-compatible Sub-1G wireless module evaluation kit | ||
| E22-400TBH-02 | USB | - | - | - | - | - | - | 59.5*97 | E22-400T37S module development test board | ||
| E22-400MBL-01 | USB | - | - | - | - | - | - | 53*27 | E22-400M22S Development Evaluation Kit | ||
| E22-900MBL-01 | USB | - | - | - | - | - | - | 53*27 | E22 series module test board | ||
| E22-400TBL-01 | USB | - | - | - | - | - | - | 58*28 | E22 series module test board | ||
| E22-400TBH-01 | USB | - | - | - | - | - | - | 80*45 | E22 series module test board | ||
| E22-230TBL-01 | USB | - | - | - | - | - | - | 58*28 | E22 series module test board | ||
| E22-230TBH-01 | USB | - | - | - | - | - | - | 80*45 | E22 series module test board | ||
| E22-900TBL-01 | USB | - | - | - | - | - | - | 58*28 | E22 series module test board | ||
| E22-900TBH-01 | USB | - | - | - | - | - | - | 80*45 | E22 series module test board |