E22-400TBH-SC LoRa module development and test board
[Interface]：Type-C
[Size]：30*85mm
[Introduction]：The SC series evaluation kit is designed to help users quickly evaluate Ebyte's new generation of package-compatible wireless modules. The development board is soldered with the E22-400M22S model lora module, and the MCU uses the STM32F103C8T6. The available pins have been led out to the pin headers on both sides to facilitate developers to carry out secondary development. The kit provides complete software application examples to help customers quickly get started with wireless data communication development. Different types of Sub-1G wireless modules can be mounted on the board according to needs.
Official Store| Module | Interface | IC | Frequency | Power | Rangekm | Communication protocol | Antenna form | Sizemm | Features | Manual | Sample |
|---|---|---|---|---|---|---|---|---|---|---|---|
| E22-900TBH-SC | Type-C | - | - | - | - | - | - | 30*85 | Soldering E22-900T30S, a new generation of package-compatible Sub-1G wireless module evaluation kit | ||
| E22-400TBH-SC | Type-C | - | - | - | - | - | - | 30*85 | Soldering E22-400T30S, a new generation of package-compatible Sub-1G wireless module evaluation kit | ||
| E22-900MBH-SC | Type-C | - | - | - | - | - | - | 30*85 | Soldering E22-900M30S, a new generation of package-compatible Sub-1G wireless module evaluation kit | ||
| E22-400MBH-SC | Type-C | LLCC68 | - | - | - | - | - | 30*85 | Soldering E220-400M30S, a new generation of package-compatible Sub-1G wireless module evaluation kit | ||
| E22-900TBL-SC | Type-C | - | - | - | - | - | - | 30*68 | Soldering E22-900T22S, a new generation of package-compatible Sub-1G wireless module evaluation kit | ||
| E22-400TBL-SC | Type-C | - | - | - | - | - | - | 30*68 | Soldering E22-400T22S, a new generation of package-compatible Sub-1G wireless module evaluation kit | ||
| E22-900MBL-SC | Type-C | - | - | - | - | - | - | 30*64 | Welded E22-900M22S, a new generation of package compatible Sub-1G wireless module evaluation kit | ||
| E22-400MBL-SC | Type-C | - | - | - | - | - | - | 30*64 | Soldering E22-400M22S, a new generation of package-compatible Sub-1G wireless module evaluation kit | ||
| E22-400TBH-02 | USB | - | - | - | - | - | - | 59.5*97 | E22-400T37S module development test board | ||
| E22-400MBL-01 | USB | - | - | - | - | - | - | 53*27 | E22-400M22S Development Evaluation Kit | ||
| E22-900MBL-01 | USB | - | - | - | - | - | - | 53*27 | E22 series module test board | ||
| E22-400TBL-01 | USB | - | - | - | - | - | - | 58*28 | E22 series module test board | ||
| E22-400TBH-01 | USB | - | - | - | - | - | - | 80*45 | E22 series module test board | ||
| E22-230TBL-01 | USB | - | - | - | - | - | - | 58*28 | E22 series module test board | ||
| E22-230TBH-01 | USB | - | - | - | - | - | - | 80*45 | E22 series module test board | ||
| E22-900TBL-01 | USB | - | - | - | - | - | - | 58*28 | E22 series module test board | ||
| E22-900TBH-01 | USB | - | - | - | - | - | - | 80*45 | E22 series module test board |