[Interface]:Type-C
[Size]:30*85mm
[Introduction]:The SC series evaluation kit is designed to help users quickly evaluate Ebyte's new generation of package-compatible wireless modules. The development board is soldered with the E22-400M22S model lora module, and the MCU uses the STM32F103C8T6. The available pins have been led out to the pin headers on both sides to facilitate developers to carry out secondary development. The kit provides complete software application examples to help customers quickly get started with wireless data communication development. Different types of Sub-1G wireless modules can be mounted on the board according to needs.
Pin number | definition | Function description |
1 | GND | Bottom ground wire |
2 | PA2 | MCU_PA2 pin |
3 | PA1 | MCU_PA1 pin |
4 | PA0 | MCU_PA0 pin |
5 | NRST | MCU reset pin |
6 | PC13 | MCU_PC13 pin |
7 | VBAT | MCU_VBAT pin |
8 | PB8 | MCU_PB8 pin |
9 | GND | Bottom ground wire |
10 | +5V | 5V power supply interface |
11 | GND | Bottom ground wire |
12 | 3.3V | 3.3V power supply interface |
13 | CLK | SWCLK |
14 | PART | SWEDING |
15 | TXD | MCU_TXD data output pin |
16 | RXD | MCU_RXD data input pin |
17 | PA8 | MCU_PA8 pin |
18 | PB15 | MCU_PB15 pin |
19 | PB14 | MCU_PB14 pin |
20 | GND | Bottom ground wire |