Home >Module>Test kits>E22
E22-400TBH-02 LoRa module development test board

[Interface]:USB

[Size]:59.5*97mm

[Introduction]:E22-400TBH-02 is an entry-level development board that uses the E22-400T37S series LoRa module named for its high-power long-distance communication. This development board has a variety of transmission methods, works in the 230/433/470MHz frequency band, LoRa spread spectrum technology, TTL level output, and supports a power supply voltage of 4.5V~15V. Most of the pins of the module on the board have been led to pin headers on both sides. Developers can easily connect various peripheral devices through jumpers according to actual needs. The development board can also be plugged into a breadboard for use.

ModuleInterfaceICFrequencyPowerRangekmCommunication protocolAntenna formSizemmFeaturesManualSample
EWT22A-900BWL22S Type-C - - - - - - 65*30 EWM22A-900BWL22S All-in-one Wireless Module Test Kit
EWT22A-400BWL22S Type-C - - - - - - 65*30 EWM22A-400BWL22S All-in-one Wireless Module Test Kit
E22P-915MBH-SC Type-C - - - - - - 30*85 E22 Test Evaluation Kit Pre-welded E22P-915M30S modules
E22P-868MBH-SC Type-C - - - - - - 30*85 E22 Test Evaluation Kit Pre-welded E22P-868M30S modules
E22-900TBH-SC Type-C - - - - - - 30*85 Soldering E22-900T30S, a new generation of package-compatible Sub-1G wireless module evaluation kit
E22-400TBH-SC Type-C - - - - - - 30*85 Soldering E22-400T30S, a new generation of package-compatible Sub-1G wireless module evaluation kit
E22-900MBH-SC Type-C - - - - - - 30*85 Soldering E22-900M30S, a new generation of package-compatible Sub-1G wireless module evaluation kit
E22-400MBH-SC Type-C LLCC68 - - - - - 30*85 Soldering E220-400M30S, a new generation of package-compatible Sub-1G wireless module evaluation kit
E22-900TBL-SC Type-C - - - - - - 30*68 Soldering E22-900T22S, a new generation of package-compatible Sub-1G wireless module evaluation kit
E22-400TBL-SC Type-C - - - - - - 30*68 Soldering E22-400T22S, a new generation of package-compatible Sub-1G wireless module evaluation kit
E22-900MBL-SC Type-C - - - - - - 30*64 Welded E22-900M22S, a new generation of package compatible Sub-1G wireless module evaluation kit
E22-400MBL-SC Type-C - - - - - - 30*64 Soldering E22-400M22S, a new generation of package-compatible Sub-1G wireless module evaluation kit
E22-400TBH-02 USB - - - - - - 59.5*97 E22-400T37S module development test board
E22-400MBL-01 USB - - - - - - 53*27 E22-400M22S Development Evaluation Kit
E22-900MBL-01 USB - - - - - - 53*27 E22 series module test board
E22-400TBL-01 USB - - - - - - 58*28 E22 series module test board
E22-400TBH-01 USB - - - - - - 80*45 E22 series module test board
E22-230TBL-01 USB - - - - - - 58*28 E22 series module test board
E22-230TBH-01 USB - - - - - - 80*45 E22 series module test board
E22-900TBL-01 USB - - - - - - 58*28 E22 series module test board
E22-900TBH-01 USB - - - - - - 80*45 E22 series module test board