[Interface]:USB
[Size]:59.5*97mm
[Introduction]:E22-400TBH-02 is an entry-level development board that uses the E22-400T37S series LoRa module named for its high-power long-distance communication. This development board has a variety of transmission methods, works in the 230/433/470MHz frequency band, LoRa spread spectrum technology, TTL level output, and supports a power supply voltage of 4.5V~15V. Most of the pins of the module on the board have been led to pin headers on both sides. Developers can easily connect various peripheral devices through jumpers according to actual needs. The development board can also be plugged into a breadboard for use.
| Module | Interface | IC | Frequency | Power | Rangekm | Communication protocol | Antenna form | Sizemm | Features | Manual | Sample |
|---|---|---|---|---|---|---|---|---|---|---|---|
| EWT22A-900BWL22S | Type-C | - | - | - | - | - | - | 65*30 | EWM22A-900BWL22S All-in-one Wireless Module Test Kit | ||
| EWT22A-400BWL22S | Type-C | - | - | - | - | - | - | 65*30 | EWM22A-400BWL22S All-in-one Wireless Module Test Kit | ||
| E22P-915MBH-SC | Type-C | - | - | - | - | - | - | 30*85 | E22 Test Evaluation Kit Pre-welded E22P-915M30S modules | ||
| E22P-868MBH-SC | Type-C | - | - | - | - | - | - | 30*85 | E22 Test Evaluation Kit Pre-welded E22P-868M30S modules | ||
| E22-900TBH-SC | Type-C | - | - | - | - | - | - | 30*85 | Soldering E22-900T30S, a new generation of package-compatible Sub-1G wireless module evaluation kit | ||
| E22-400TBH-SC | Type-C | - | - | - | - | - | - | 30*85 | Soldering E22-400T30S, a new generation of package-compatible Sub-1G wireless module evaluation kit | ||
| E22-900MBH-SC | Type-C | - | - | - | - | - | - | 30*85 | Soldering E22-900M30S, a new generation of package-compatible Sub-1G wireless module evaluation kit | ||
| E22-400MBH-SC | Type-C | LLCC68 | - | - | - | - | - | 30*85 | Soldering E220-400M30S, a new generation of package-compatible Sub-1G wireless module evaluation kit | ||
| E22-900TBL-SC | Type-C | - | - | - | - | - | - | 30*68 | Soldering E22-900T22S, a new generation of package-compatible Sub-1G wireless module evaluation kit | ||
| E22-400TBL-SC | Type-C | - | - | - | - | - | - | 30*68 | Soldering E22-400T22S, a new generation of package-compatible Sub-1G wireless module evaluation kit | ||
| E22-900MBL-SC | Type-C | - | - | - | - | - | - | 30*64 | Welded E22-900M22S, a new generation of package compatible Sub-1G wireless module evaluation kit | ||
| E22-400MBL-SC | Type-C | - | - | - | - | - | - | 30*64 | Soldering E22-400M22S, a new generation of package-compatible Sub-1G wireless module evaluation kit | ||
| E22-400TBH-02 | USB | - | - | - | - | - | - | 59.5*97 | E22-400T37S module development test board | ||
| E22-400MBL-01 | USB | - | - | - | - | - | - | 53*27 | E22-400M22S Development Evaluation Kit | ||
| E22-900MBL-01 | USB | - | - | - | - | - | - | 53*27 | E22 series module test board | ||
| E22-400TBL-01 | USB | - | - | - | - | - | - | 58*28 | E22 series module test board | ||
| E22-400TBH-01 | USB | - | - | - | - | - | - | 80*45 | E22 series module test board | ||
| E22-230TBL-01 | USB | - | - | - | - | - | - | 58*28 | E22 series module test board | ||
| E22-230TBH-01 | USB | - | - | - | - | - | - | 80*45 | E22 series module test board | ||
| E22-900TBL-01 | USB | - | - | - | - | - | - | 58*28 | E22 series module test board | ||
| E22-900TBH-01 | USB | - | - | - | - | - | - | 80*45 | E22 series module test board |