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SX1262 chip
LoRa module
SX1262 chip
LoRa module
E22-170M33S SX1262 RF Transceiver Module LoRa spread spectrum technology 16 km longer distance Smaller size lower power consumption

[Chip Solution]：SX1262

[Frequency]：150.125-170.125 MHz

[Transmit power]：33 dBm

[Communication diatance]：16 km

[Size]：24 x 38.5 mm

[Product weight]： 5.1 ± 0.2 g

[Introduction]：The E22-170M33S is an ultra-compact, 170.125MHz surface-mount LoRa wireless module developed independently, based on Semtech's new-generation LoRa™ RF chip, the SX1262. Using the imported SX1262 as its core, the module offers improved anti-interference performance and communication range compared to previous-generation LoRa™ transceivers. Utilizing the latest LoRa™ modulation technology, its anti-interference performance and communication range far exceed those of existing FSK and GFSK modulation methods. This LoRa module is primarily targeted at smart home applications, wireless meter reading, scientific research and medical applications, and medium- and long-range wireless communication equipment.

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PIN
Pin number Pin Name Pin direction Pin Purpose
1 GND - Ground wire, connected to the power reference ground
2 GND - Ground wire, connected to the power reference ground
3 GND - Ground wire, connected to the power reference ground
4 GND - Ground wire, connected to the power reference ground
5 GND - Ground wire, connected to the power reference ground
6 RXEN input The RF switch receives the control pin and connects to the external MCU IO. Please refer to Table 1 below for logic control and the control routines on the EBYTE official website DEMO.
7 TXEN input The RF switch transmit control pin is connected to an external MCU IO or DIO2 (see the SX1262 manual for details). For logic control, please refer to Table 1 below. For control routines, please refer to the EBYTE official website DEMO.
8 DIO2 Input/Output Configurable general IO port (see SX1262 manual for details)①
9 VCC - Power supply, range 2.5～5.5V (it is recommended to add external ceramic filter capacitor)
10 VCC - Power supply, range 2.5～5.5V (it is recommended to add external ceramic filter capacitor)
11 GND - Ground wire, connected to the power reference ground
12 GND - Ground wire, connected to the power reference ground
13 DIO1 Input/Output Configurable general IO port (see SX1262 manual for details)
14 BUSY Output Used for status indication (see SX1262 manual for details)
15 NRST input Chip reset trigger input pin, low level is valid
16 MISO Output SPI data output pin
17 MONEY input SPI data input pin
18 SCK input SPI clock input pin
19 NSS input Module chip select pin, used to start an SPI communication
20 GND - Ground wire, connected to the power reference ground
21 ON - Antenna interface, stamp hole (50Ω characteristic impedance). Because the module has a built-in PA, there is an amplification relationship between the output power of the SX1262 RF chip (pre-stage) and the actual output power of the module. Please refer to Table 2 below.
22 GND - Ground wire, connected to the power reference ground
- DIO3 Input/Output Used internally in the module to power the 32MHZ TCXO crystal oscillator (DIO3 is configured to output 2.2V)


Note ①: If the DIO and TXEN pins are short-circuited, the DIO2 switch control function needs to be enabled in the software.