E21-230G37S_Other_SPI/SOC/UART_Module

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E21-230G37S Power amplifier PA module second harmonic and power Long-distance communication LNA low noise amplifier

[Communication interface]：stamp hole

[Transmitting power]：37dBm

[Communication distance]： 20km

[Receive gain]：15dBm

[Introduction]：E21-230G37S is a pure hardware RF medium power amplifier (PA) with a maximum output power of 37dBm and a frequency range of 220 to 236MHz. It has a built-in LNA low noise amplifier and uses high-quality PA chips + unique design solutions to greatly improve PA working efficiency and enable continuous data transmission at an ambient temperature of -40 to +85 degrees. It has built-in filters, limiters, and low noise coefficients to improve the receiving channel's receiving sensitivity and extend the communication distance.

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Pin number	Pin name	Pin direction	Pin usage
1	GND	-	Ground wire, connected to the reference ground
2	+7.5V	-	PA drive power supply VCC1
3	+7.5V	-	PA drive power supply VCC1
4	GND	-	Ground wire, connected to the reference ground
5	+5V	-	Control power supply VCC2
6	GND	-	Ground wire, connected to the reference ground
7	TXEN	enter	Transmit mode enabled, active at high level (supports 3.3V/5V level)
8	RXEN	enter	Receive mode enabled, active at high level (supports 3.3V/5V level)
9	GND	-	Ground wire, connected to the reference ground
10	PIN	input/output	Transmitting mode: RF signal input/receiving mode: RF signal output
11	PoUT	Output/Input	Transmitting mode: RF signal output/receiving mode: RF signal input
12	GND	-	Ground wire, connected to the reference ground
13	GND	-	Ground wire, connected to the reference ground
14	GND	-	Ground wire, connected to the reference ground
15	GND	-	Ground wire, connected to the reference ground
16	GND	-	Ground wire, connected to the reference ground
17	GND	-	Bottom heat dissipation pad, connect module GND
Note: 1. TXEN and RXEN cannot be opened at the same time at any time. Opening them at the same time may cause direct damage to the PA module. 2. The bottom pad is connected to the internal GND and needs to be coated with silicone grease for heat dissipation or soldered to the bottom board to enhance heat dissipation.

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