[Chip solution]:Si24R1
[Communication interface]:SPI
[Carrier frequency]: 2.4~2.525GHz
[Transmission power]:27dBm
[Reference distance]:5km
[Product weight]:6.06±0.1g
[Product size]:18*33.4mm
[Introduction]:The E01C-2G4M27D is a 2.4GHz DIP wireless module with a maximum transmit power of 500mW based on the domestic Si24R1.The module has built-in power amplifier (PA) and low-noise amplifier (LNA), which makes the maximum transmitting power reach 500mW, and the communication stability is greatly improved compared with the products.without power amplifier and low-noise amplifier, and the industrial-grade high-precision 16MHz crystal is used.
| Pin Serial Number | Pin Name | Pin Direction | Pin Usage |
| 1 | GND | - | Ground wire, connected to power reference ground |
| 2 | VCC | - | Power supply, to ensure full power output, it is recommended to use ≥ 3.3V power supply |
| 3 | CE | Input | Module control pins |
| 4 | CSN | Input | Module chip select pin to start an SPI communication |
| 5 | SCK | Input | Module SPI bus clock |
| 6 | MOSI | Input | Module SPI data input pins |
| 7 | MISO | Output | Module SPI data output pins |
| 8 | IRQ | Output | Module interrupt signal output, active low |
| 9 | GND | - | Ground wire, connected to power reference ground |
| 10 | GND | - | Ground wire, connected to power reference ground |
| 11 | GND | - | Ground wire, connected to power reference ground |
| 12 | GND | - | Ground wire, connected to power reference ground |