Against the backdrop of the growing demand for long-range, low-power, and anti-interference communication in IoT devices, the E22P-868M30S and E22P-915M30S LoRa modules have emerged as the "communication hub" in industrial sensors, smart homes, automotive remote controls, and other fields, leveraging their Hardcore performance based on the Semtech SX1262 chip.

EWM22M-xxxT22S is an ultra-small, low-cost wireless UART module with multiple transmission modes. It adopts LoRa communication technology fully compatible and interoperable with E22, featuring a maximum transmit power of 22dBm and operating in the 400MHz or 900MHz frequency bands.

The E290-M(3029) series is a high-performance surface-mount ChirpIoT™ wireless module independently developed based on Panchip's new-generation domestic RF chip PAN3029, suitable for 433MHz and 470MHz frequency bands.

The E290-Mseries is a high-performance surface-mount ChirpIoT™ wireless module independently developed based on Panchip's new-generation domestic RF chip PAN3060, operating in the 433MHz and 470MHz frequency bands.

The E22-170M series is a self-developed ultra-compact surface-mount LoRa™ wireless module based on Semtech's next-generation LoRa™ RF chip SX1262, operating in the 170.125MHz band. Powered by the imported SX1262 core, it delivers enhanced anti-interference performance and longer communication distance compared to previous-generation LoRa™ transceivers.

The E860-DTU series is an industrial-grade wireless transceiver switch based on LoRa modulation technology, designed for remote transmission of switch signals. It supports both digital input (DI) acquisition and relay output (DO) control, enabling wireless on/off control without wiring

EBYTE’s E22-170T30S and E22-170T33S are high-performance LoRa wireless modules operating in the 150.125–173.125MHz frequency band (default 170.125MHz). These modules are designed for long-range, low-power IoT applications, offering 30dBm (1W) and 33dBm (2W) transmit power for extended coverage.

The M31-L9 series LoRa distributed remote I/O host modules are wireless LoRa distributed I/O host modules developed and manufactured by Ebyte in the 850.125-930.125 MHz operating frequency band. Three models are available: the M31-AAAX4440G-L9 (LoRa Host with 4 DIs, 4 AIs, and 4 DOs), the M31-AXAX8080G-L9 (LoRa Host with 8 DIs, 8 DOs), and the M31-XAXA0404G-L9 (LoRa Host with 4 AIs and 4 AOs). These models differ primarily in the number of input and output channels.

Wireless Module Selection Guide | EBYTE IoT Communication Solutions，wireless module, IoT communication, LoRa module, Wi-Fi module, Bluetooth module, ZigBee module, EBYTE products

The EWM22A-400BWL22S/EWM22A-900BWL22S series is a Bluetooth Low Energy (BLE)/Wi-Fi/LoRa all-in-one wireless data transmission module developed by Ebyte

In the Internet of Things (IoT) field, LoRa technology, known for its low-power, long-range wireless communication, has become a key solution in industries such as smart agriculture, smart cities, and industrial automation.

The E290-400T30S/E290-900T20S​ are a new generation of wireless modules developed by Ebyte. Based on the Panqi Micro PAN3060 RF chip, these wireless serial port modules (UART) offer multiple transmission modes, operating in the 410.125-493.125MHz and 850.125-930.125MHz frequency bands. Both modules utilize ChirpIoT™ spread spectrum technology and feature TTL output.

Logistics tracking is one of the core application scenarios of LoRa technology. Its requirements for "low - power wide - area coverage, multi - sensor access, and data security" are highly consistent with the characteristics of LoRa.

As LoRa technology becomes ubiquitous in critical infrastructure—from smart grids and industrial control systems to healthcare monitoring and financial asset tracking—security encryption has emerged as a non-negotiable requirement in 2025.

In 2025, the LoRa module industry is undergoing a transformative shift toward integration, driven by the demand for simplified IoT deployments, reduced power consumption, and enhanced functionality. Integration—defined as the consolidation of core components (radio transceivers, microcontrollers, sensors, and connectivity protocols) into a single module—has become the cornerstone of innovation, enabling smaller form factors, lower costs, and faster time-to-market for IoT solutions.