Introduction
In industrial automation, Profinet and Modbus are the two most dominant communication protocols. Profinet is widely used in mainstream PLC systems such as Siemens, while Modbus RTU/IO serves as the "universal language" for field devices such as sensors, drives, and instruments. However, connecting a Profinet master (e.g., a PLC) with Modbus slave devices (field equipment) has long been a major challenge for engineers — requiring either expensive dedicated gateways or complex code development.
Traditional solutions often require developers to write extensive low-level protocol code, resulting in long development cycles and questionable stability. Worse still, when different brands of devices need to be connected, the complexity of protocol conversion increases exponentially — a classic "last mile" dilemma in industrial communication.
EBYTE introduces the EBT3003 chip and EBT3003-TB test kit — a plug-and-play solution purpose-built to solve this pain point. As a highly integrated Profinet-to-Modbus/IO/Transparent-transmission chip, the EBT3003 allows users to connect Profinet systems with field devices effortlessly by simply importing a GSD file — without writing a single line of code — dramatically lowering the development threshold and deployment cost of industrial communication
Product Overview: One Chip, One Kit, Bridging Industrial Communication
1. EBT3003: The Profinet Core Chip
The EBT3003 is a Profinet chip specially designed for industrial communication by Chengdu Ebyte Electronic Technology Co., Ltd.
Core Function: Protocol conversion between Profinet and Modbus master/slave, Profinet and serial transparent transmission, and Profinet IO.
Product Form: LQFP100 package, dimensions 14.0mm × 14.0mm × 1.4mm, compact enough to be embedded directly into customer-designed PCBs.
Core Value: An ideal solution for meter reading, industrial control, and device integration.
2. EBT3003-TB: The Test Kit
The EBT3003-TB is a companion test kit for the EBT3003 chip launched by Chengdu Ebyte Electronic Technology Co., Ltd.
Core Function: Provides a complete hardware environment for quick evaluation of the EBT3003 chip and prototype development.
Product Form: A test board integrating the EBT3003 chip.
Core Value: Features a Type-C power interface, with all LED indicators, function pins, and reset buttons brought out. In particular, the operating status indicator pins are connected to external LEDs, allowing users to observe and debug the module's working status in real time
Features and Model Comparison
EBT3003 Chip Core Features
No Programming Required — GSD File Integration: This is the EBT3003's most critical advantage. Using a standard GSD file, users can integrate the EBT3003 as a Profinet slave into a PLC system directly in Siemens STEP 7 or TIA Portal software, and configure its data mapping — all without writing any underlying code. "Minimal configuration, ready to use."
Three Protocol Conversion Modes: Supports flexible operating modes:
Profinet to Modbus RTU Master: The EBT3003 acts as a Modbus master, actively polling field device data.
Profinet to Modbus RTU Slave: The EBT3003 acts as a Modbus slave, responding to connected Modbus master requests.
Profinet to Serial Transparent Transmission: Enables transparent data transfer between Profinet and serial interfaces.
Supports 32 Channels of Profinet IO: In addition to serial communication, the EBT3003 supports 32 channels of Profinet IO (DI/DO/AI), enabling direct acquisition and control of digital and analog signals from field devices.
Powerful Memory Mapping: User-defined Modbus commands are loaded in a modular format, and the memory mapping relationship between Profinet and Modbus is directly visible in TIA Portal — highly intuitive.
Real-Time Device Status Monitoring: Status bytes can be loaded to query the connection status of Modbus devices, providing real-time visibility into network health.
Industrial-Grade Reliability:
Uses standard Profinet protocol for communication, seamlessly connecting with Siemens S7-200/300/1200/1500 full series PLCs.
Supports 10/100M Ethernet interface with auto-crossover detection.
EBT3003-TB Test Kit Features
Type-C Power Supply: Powered via USB Type-C interface, no additional power adapter needed.
All Pins Brought Out: All function pins (including GPIO, UART, etc.) are routed to pin headers or interfaces for easy connection to external devices during debugging.
Reset Button: Provides an intuitive reset button for easy chip restart.
LED Status Indicators: All LED indicators (system status, communication status, etc.) are brought out with external LEDs for convenient observation of device operation status.
Chip vs. Test Kit Comparison
| Dimension | EBT3003 (Chip) | EBT3003-TB (Test Kit) |
|---|---|---|
| Product Form | LQFP100 packaged chip | Test board with integrated EBT3003 |
| Application Stage | Mass production (embed into custom PCB) | Evaluation, development, prototyping |
| Power Supply | Requires user-designed power circuit (3.3V) | Built-in Type-C power, quick and convenient |
| Pin Access | Requires PCB routing by user | All pins brought out, easy to connect peripherals |
| Debugging | Requires soldering LEDs or using oscilloscope | All LEDs and status pins already brought out |
| Price | Low (suitable for volume purchasing) | Higher (includes board, connectors, etc.) |
In a nutshell: First purchase the EBT3003-TB test kit for rapid functional verification, then order the EBT3003 chip in volume for integration into your own product
Technical Specifications
| Core Parameter | EBT3003 / EBT3003-TB |
|---|---|
| Chip Solution | Industrial-grade Profinet dedicated chip |
| Supported Protocols | Profinet (RT) / Modbus RTU / Serial Transparent / Profinet IO |
| PLC Compatibility | Siemens S7-200/300/1200/1500 full series, TIA Portal / STEP 7 |
| Ethernet | 10/100M auto-negotiation, auto-crossover, RJ45 interface |
| Ethernet Standard | IEEE 802.3 / 802.3u |
| Serial Functions | Modbus RTU Master/Slave / Transparent Transmission / Profinet IO |
| IO Capability | Up to 32 channels (DI/DO/AI, configurable) |
| Modbus Commands | Up to 32 |
| Profinet IO Count | 32 channels, 4 sub-slots |
| Operating Voltage | 3.3V ± 0.2V |
| Operating Current | Peak: 86mA; Standby: 83mA |
| Power Consumption | Low power design |
| Communication Level | 3.3V |
| Operating Temperature | -40°C ~ +85°C, 5% ~ 95% RH (non-condensing) |
| Storage Temperature | -40°C ~ +105°C, 5% ~ 95% RH (non-condensing) |
| Package | LQFP100 (14mm × 14mm × 1.4mm) |
| Weight (Chip) | 1g ± 0.1g |
| Dimensions (TB Kit) | Approx. 50mm × 40mm |
Application Scenarios
Scenario ①: Factory Automation Device Integration
Pain Point: Factories need to integrate numerous machines (e.g., motor drives, smart meters, temperature controllers — all Modbus devices) into a Siemens PLC control system.
Solution: Integrate the EBT3003 into the product, quickly configure it in TIA Portal using the GSD file. The PLC reads and writes the EBT3003's memory via Profinet, indirectly controlling all field devices. Say goodbye to complex protocol development and debugging.
Scenario ②: Industrial IoT Gateway
Pain Point: Need to upload serial data (Modbus RTU) from legacy devices to an upper-level management system via the Profinet network.
Solution: Use the EBT3003's Profinet-to-Serial function to transparently transmit serial data to the PLC or host computer, enabling legacy devices to connect to the network with ease.
Scenario ③: Remote IO System
Pain Point: Field sites need to collect multiple digital input (DI) signals and output control signals (DO).
Solution: Leverage the EBT3003's 32-channel Profinet IO capability to directly connect sensors and relays for remote IO control. IO addresses can be directly mapped in TIA Portal for convenient program management.
Scenario ④: Rapid Product Iteration
Pain Point: Automation equipment manufacturers need to quickly launch new products with Profinet protocol support.
Solution: Use the EBT3003-TB test kit for rapid protocol validation and functional testing. Once verified, integrate the EBT3003 chip into the new product's PCB, significantly shortening the development cycle.
EBYTE Core Advantages
| Advantage | Description |
|---|---|
| Code-Free Configuration | The biggest differentiator. Traditional Profinet slave implementation requires deep embedded development expertise. The EBT3003 provides a GSD file for graphical configuration in STEP 7 or TIA Portal — no coding needed, dramatically lowering the development barrier. |
| Intuitive Memory Mapping | Modbus commands are loaded in modular format; the memory mapping between Profinet and Modbus is clearly visible in TIA Portal for easy troubleshooting and maintenance. |
| Powerful Functional Integration | A single chip supports Profinet-to-Modbus RTU master, slave, serial transparent transmission, and Profinet IO — replacing multiple separate devices, reducing hardware cost, wiring complexity, and failure points. |
| Ultra-Compact Size & Low Power | LQFP100 package (14x14mm) and 1g weight ideal for space-constrained embedded devices; peak power consumption of only 86mA. |
| Complete Development Ecosystem | EBT3003-TB test kit, comprehensive user manual (technical parameters, pin definitions, hardware reference design, module configuration, alarm information, etc.) covering the entire process from evaluation to mass production. |
| Industrial-Grade Reliability & Compatibility | Designed for industrial environments: -40~+85°C wide temperature range; fully compatible with Siemens S7-200/300/1200/1500 full series PLCs — a must-have for virtually all Profinet gateway applications. |
FAQ
Q1: What is the difference between EBT3003 and EBT3003-TB? Which should I buy?
A: Both share the same core functionality, but differ in form:
EBT3003: A bare chip (LQFP100 package). You need to design the peripheral circuitry (power, crystal, Ethernet transformer, etc.) and handle soldering. Suitable for companies with in-house hardware design teams preparing for mass production.
EBT3003-TB: A complete test kit integrating the EBT3003 chip with all peripheral circuits. Features Type-C power, all pins brought out, buttons, and LED indicators. Simply plug in power and an Ethernet cable to start evaluating chip functionality. Ideal for engineers performing prototype verification, software development, and functional evaluation.
Recommendation: First purchase the EBT3003-TB test kit for development and verification. Once all functions are stable, order the EBT3003 chip in volume for your production design.
Q2: How to get started with the EBT3003 quickly?
A: For the test kit, the general workflow is:
Power on the EBT3003-TB via Type-C.
Connect the EBT3003-TB to your computer (or PLC) with an Ethernet cable.
In STEP 7 or TIA Portal, install the GSD file downloaded from the Ebyte website.
In hardware configuration, add the EBT3003 as a Profinet slave device.
Configure the I/O mapping and load your Modbus commands in modular format.
Download the configuration to the PLC — Profinet-to-Modbus communication is now established.
Q3: Which Modbus function codes does the EBT3003 support?
A: According to the manual, the EBT3003 supports standard Modbus RTU protocol function codes including: 01H, 02H, 03H, 04H, 05H, 06H, 0FH, 10H — covering commonly used read/write coil and holding register operations.
Q4: How are the Profinet IO sub-slots allocated?
A: The EBT3003 supports 4 sub-slots (managed under Slot 2), each managing 8 IO channels for a total of 32 IO channels:
Sub-slot 1: Manages IO1-IO8, supports DI, AI, DO.
Sub-slots 2, 3, 4: Manage IO9-IO16, IO17-IO24, IO25-IO32 respectively, support DI or DO only.
Q5: How do I configure the EBT3003's Modbus commands?
A: In TIA Portal, after adding the EBT3003 as a Profinet slave, select the "Modbus Master" or "Modbus Slave" module from the GSD file's module library, then configure the sub-slots:
Set Slave Address
Select Function Code
Set Start Address
Set Quantity
Select Trigger Type: Polling trigger, level trigger, rising edge trigger, etc.
Q6: What external storage does the chip integrate?
A: The EBT3003 manual does not explicitly specify external storage. Configuration storage relies on the chip's internal Flash or external EEPROM.
Q7: How does the EBT3003 handle alarms and status notifications?
A: The EBT3003 does not send email alerts directly. It transmits error information to the PLC via the Profinet alarm mechanism for viewing in the host computer software for status monitoring and diagnostics. Common error alarms include:
Engineering-related errors: Function Code Error, Data Address Error, Data Value Error, Slave Device Failure, Unknown Error
Network/CRC-related errors: Frame Length Error, CRC Check Error, Register Number Error, Slave Address Error, Timeout Error, Function Code Different, Register Address Error
The EBT3003 chip and EBT3003-TB test kit are Ebyte's flagship combination purpose-built to simplify industrial Profinet communication. With "code-free configuration, functional integration, and extremely low development threshold" as their core highlights, they precisely solve the pain points of complexity, long development cycles, and difficult debugging that engineers face when connecting Siemens PLCs with Modbus devices.
