Introduction

In the field of IoT wireless communication, the Sub-GHz frequency band (such as 433MHz, 868MHz, 915MHz) is renowned for its long range and strong penetration capability, making it the preferred choice for long-distance low-power scenarios. Meanwhile, the 2.4GHz frequency band, with its high data rate and global license-free advantage, is widely used for short-range high-speed data transmission. For a long time, engineers have had to deploy two separate modules in a single device to support both bands, which not only increases design complexity but also drives up costs and strains PCB space.

The E80-400M2212S and E80-900M2212S dual-band LoRa modules, along with their  E80-400MBL-02 and E80-900MBL-02 evaluation kits, launched by Chengdu EBYTE Electronic Technology Co., Ltd., are purpose-built to solve this challenge.

• Core Module: Based on the Semtech LR2021 fourth-generation LoRa Plus IP chip — a single chip that simultaneously supports both Sub-GHz and 2.4GHz dual bands.

• Evaluation Kit: Equipped with an STM32F103C8T6 MCU, providing complete software demos and reference designs to help users quickly complete wireless data communication testing and development.

This article provides an in-depth analysis of how this product combination solves the "dual-band pain point" for engineers, covering product definition, technical specifications, application scenarios, and more.

Product Overview

1.1 E80-400M2212S & E80-900M2212S: Dual-Band LoRa Core Modules

These two modules are dual-band SMD LoRa hardware SPI wireless modules independently developed by Chengdu EBYTE Electronic Technology Co., Ltd., based on the Semtech LoRa Plus fourth-generation LoRa IP — the LR2021 chip.

Important Note: These modules are pure hardware RF modules. Users must program them via the SPI interface. They are suitable for teams with MCU development capabilities.

1.2 E80-400MBL-02 & E80-900MBL-02: Dual-Band LoRa Evaluation Kits

These two evaluation kits are development platforms specifically designed to help users quickly evaluate the performance of the above modules.

Features and Model Comparison

Core Module Features

1. True Dual-Band Integration

This is the most important selling point of the E80-xxxM2212S series. A single LR2021 chip simultaneously supports:

• Sub-GHz Band: 410-493MHz or 850-930MHz, with transmit power up to +22dBm and a communication range of up to 5km under ideal conditions.

• 2.4GHz Band: 2400-2500MHz, with transmit power of +12dBm and a communication range of up to 2.2km under ideal conditions.

This means a single module can achieve both long-distance Sub-GHz data collection and short-range 2.4GHz high-speed data interaction.

2. Fourth-Generation LoRa Plus IP

• Utilizes Semtech's latest LoRa Plus fourth-generation IP, with receive sensitivity as high as -142dBm (@LoRa 125kHz Sub-GHz).

• Fully compatible with SX126x, SX127x, SX128x, and LR11xx series chips, enabling seamless integration with existing systems.

• Introduces FLRC (Fast Long Range Communication) modulation, achieving data rates up to 2.6 Mbps — a significant leap over traditional LoRa's rate ceiling.

About the LR2021 Chip: The LR2021 is Semtech's first chip in the LoRa Plus series. It integrates the fourth-generation LoRa IP and supports both terrestrial networks and satellite communication (SATCOM), covering Sub-GHz, 2.4GHz ISM band, L-band, and licensed S-band. Key improvements over the previous generation (LR1121) include:

• 4.5dB sensitivity improvement in Sub-GHz mode

• FLRC mode for high-speed communication up to 2.6Mbps

• LoRa mode rate doubled to 125kbps

• Frequency offset tolerance increased to ±33% of bandwidth (vs. ±25% on Gen3)

• Fast CAD (Channel Activity Detection) reduces power consumption by approximately 70% in listen-before-talk scenarios

• Multi-SF CAD supports parallel detection of up to 4 different spreading factors

• Convolutional coding (CR8/CR9) with long interleaving for enhanced抗干扰 capability

• Integrated SIMO DC-DC converter with >85% efficiency

• Built-in RTToF ranging and NTC temperature compensation

3. Flexible Antenna Design

The module features a dual antenna interface design (IPEX-1 + Stamp Hole). Sub-GHz and 2.4GHz each have independent antenna interfaces, eliminating mutual interference.

4. Industrial-Grade Reliability

• Built-in industrial-grade 32MHz high-precision active temperature-compensated crystal oscillator (TCXO) and 32.768KHz low-frequency crystal.

• Operating temperature range: -40°C to +85°C, meeting industrial-grade requirements.

5. Pure Hardware RF Module

Note: This module requires users to program it themselves (via the SPI interface). It is suitable for teams with MCU development capabilities. The pure SPI interface allows users to flexibly choose their own MCU platform.

Evaluation Kit Features

1. One-Click Quick Demo

• Onboard STM32F103C8T6 MCU with most pins broken out.

• Provides complete wireless transceiver software application example source code. Using the E80_DEMO software (Keil project) provided by EBYTE, users can achieve data transmission and reception demonstrations.

2. Serial Port Data Transparent Transmission

• Connect to a PC via USB Type-C to UART interface. Using serial port assistants like XCOM, users can achieve wireless data transparent transmission without writing a single line of code to verify the module's communication capability.

3. Rich Special Commands

• Supports sending HEX commands via the serial port for advanced operations such as frequency setting, single carrier transmission, and RF low-power configuration.

• For example: C1 00 18 70 1A 80 can quickly configure the module's operating frequency to 410MHz.

4. Dual SMA Antenna Interfaces

• The evaluation board provides Sub-GHz SMA-K and 2.4GHz SMA-K antenna interfaces, making it easy to connect standard antennas for testing.

Core Module vs. Evaluation Kit Comparison

Technical Specifications

Core Module RF Parameters

Core Module Electrical and Hardware Parameters

Evaluation Kit Key Parameters

Application Scenarios and User Needs

The E80 series dual-band LoRa modules and evaluation kits precisely address the following user needs:

Scenario 1: Multi-Band Sensor Data Acquisition System

• Requirements: Need to simultaneously utilize Sub-GHz's long range for data backhaul and 2.4GHz's high speed for short-range data aggregation.

• Solution: The E80-xxxM2212S's dual-band capability allows a single module to switch between different frequency bands, enabling flexible data routing.

Scenario 2: Smart Meters and Energy Management (AMI)

• Requirements: Meter data needs to be transmitted back via long-range wireless network monthly (or daily); meter firmware upgrades require high-speed local connectivity.

• Solution: Sub-GHz (470MHz band) for remote meter reading; 2.4GHz for on-site engineer high-speed maintenance and firmware upgrades.

Scenario 3: Smart Factory Asset Management

• Requirements: Need long-distance tracking of personnel/asset locations (Sub-GHz), while also requiring fast data exchange between devices (2.4GHz).

• Solution: The dual-band module can automatically switch frequency bands based on task requirements, achieving a perfect combination of "long-range positioning + short-range high-speed data interaction."

Scenario 4: Smart Home (Balancing Whole-Home Coverage and Local High Speed)

• Requirements: A smart home gateway needs to connect sensors throughout the entire house (Sub-GHz's strong penetration) while simultaneously interacting at high speed with multimedia devices in the living room (2.4GHz).

• Solution: One module solves two connectivity needs, simplifying gateway design.

Scenario 5: Smart Agriculture

• Requirements: Soil sensors, weather stations, and irrigation valves distributed across vast farmland need long-range data backhaul; drones or handheld devices need high-speed local data offloading during field inspections.

• Solution: Sub-GHz provides kilometer-level coverage for sensor networks; 2.4GHz enables high-speed data collection during on-site visits.

EBYTE Core Advantages

Dual-Band Integrated Solution

A single LR2021 chip achieves both Sub-GHz and 2.4GHz dual-band transmission and reception, significantly reducing PCB area and Bill of Materials (BOM) costs.

Complete Development Ecosystem

• Core Modules: Provide detailed product specifications, pin definitions, reference circuits, hardware design guidelines, and common problem solutions.

• Evaluation Kits: Provide pre-loaded demo development boards, serial port assistant quick start guides, EBYTE custom SDK (E80_DEMO), and Semtech official SDK reference examples.

Two Development Paths

EBYTE offers both the EBYTE custom SDK (based on Keil, suitable for quick start) and the Semtech official SDK (based on VS Code, closer to the original factory implementation). Developers can choose according to their preferences.

High Sensitivity and Long Range

-142dBm ultra-high sensitivity in Sub-GHz mode, combined with 22dBm high power, ensures stable communication in harsh environments.

Core Module + Evaluation Kit Strategy

First use the E80-xxxMBL-02 development board to quickly verify functionality and communication performance. Once confirmed, purchase the E80-xxxM2212S core module for mass production design.

Frequently Asked Questions (FAQ)

Q1: What is the core difference between E80-400M2212S and E80-900M2212S?

A: The core difference lies in the supported Sub-GHz operating frequency band:

• E80-400M2212S: Operates at 410-493MHz (covering China's 433MHz and 470MHz meter reading bands).

• E80-900M2212S: Operates at 850-930MHz (covering Europe's 868MHz, North America's 915MHz bands, etc.).

• The 2.4GHz band (2400-2500MHz) is identical for both modules. The reference circuits are also completely consistent.

Q2: What is the difference between E80-xxxM2212S and E80-xxxM2213S?

A: These two modules belong to different generations. The core differences are in the chip, performance, and packaging:

• E80-xxxM2212S (this article's subject): Based on the LR2021 chip (fourth-generation LoRa IP), dimensions 26×16mm.

• E80-xxxM2213S: Based on the LR1121 chip (third-generation LoRa IP), dimensions 26×16mm.

• Key differences: The fourth-generation LR2021 has higher receive sensitivity (-142dBm Sub-GHz vs. -136dBm for LR1121); the LR1121 has slightly higher 2.4GHz transmit power (13dBm vs. 12dBm for LR2021). The LR2021 additionally supports FLRC mode (up to 2.6Mbps) and has improved frequency offset tolerance.

Q3: How do I start evaluating quickly? Which should I buy?

A: It is strongly recommended to first purchase the E80-xxxMBL-02 evaluation kit. After unboxing, follow these steps:

1. Connect the USB cable to the PC (power + serial communication).

2. Install the CH340 driver (if not already installed).

3. Open the XCOM serial port assistant and configure the corresponding parameters.

4. Send data via the serial port — two development boards can achieve wireless data transparent transmission.

Conclusion: First buy the evaluation kit (E80-xxxMBL-02) for quick verification. After verification passes, purchase the core modules (E80-xxxM2212S) in bulk for mass production.

Q4: Can the module really achieve 5km (Sub-GHz) and 2.2km (2.4GHz) communication range?

A: These are test data under ideal conditions (clear open area, high-gain antenna, antenna height 2.5m, air data rate 2.4kbps). In practical applications, please consider the following attenuation factors:

• Line-of-sight obstructions (buildings, trees, walls, etc.) will significantly shorten the range.

• Metal objects near the antenna or placement inside a metal enclosure will cause severe signal attenuation.

• Ground absorption, reflection, seawater absorption, and other environmental factors have a significant impact.

• Improper power and air data rate settings will also affect the range.

Q5: What is the module's power consumption? How much current does the power supply need to provide?

A: The LR2021 chip features excellent power characteristics:

• Sleep current: As low as 470nA (typical)

• Receive current (Sub-GHz): Approximately 5.7mA

• Transmit current (Sub-GHz @ +22dBm): Approximately 105mA

• Transmit current (Sub-GHz @ +14dBm): Approximately 27mA

• Transmit current (Sub-GHz @ +10dBm): Approximately 12mA

Recommendation: Use a power supply capable of providing at least 200mA to ensure stable operation during peak transmission.

Q6: Does the module support the LoRaWAN protocol?

A: Yes. The LR2021 chip is fully compatible with the LoRaWAN protocol at both Sub-GHz and 2.4GHz. It also supports multiple other protocols including Amazon Sidewalk, Sigfox BPSK, Wi-SUN FSK, Wireless M-BUS, Z-Wave, IEEE 802.15.4 (Thread/Zigbee O-QPSK), and Bluetooth LE 5.0 PHY. However, since the E80-xxxM2212S is a pure SPI hardware RF module, users need to implement the protocol stack on their host MCU.

Q7: What is FLRC modulation? Why is it important?

A: FLRC (Fast Long Range Communication) is a new modulation mode introduced in the fourth-generation LR2021 chip. It offers a significant speed improvement over traditional LoRa modulation:

• FLRC maximum rate: 2.6 Mbps

• Traditional LoRa maximum rate (LR2021): 125 kbps

• Traditional LoRa maximum rate (previous generations): 62.5 kbps

FLRC is ideal for applications requiring higher data throughput while maintaining long-range capability, such as over-the-air firmware updates, image transmission, and audio streaming.

Q8: What is the difference between the E80-400MBL-02 and E80-900MBL-02 evaluation kits?

A: The two evaluation kits differ only in the onboard module:

• E80-400MBL-02: Ships with the E80-400M2212S module (410-493MHz Sub-GHz).

• E80-900MBL-02: Ships with the E80-900M2212S module (850-930MHz Sub-GHz).

Both evaluation boards can accept either module type. Users can purchase one evaluation kit and swap modules as needed. The MCU, interfaces, and demo software are identical.

Q9: What development tools and software are provided?

A: EBYTE provides two development paths:

1. EBYTE Custom SDK (E80_DEMO): Based on Keil MDK, this is a simplified demo project tailored for the E80 series. It is suitable for quick start and basic functionality verification.

2. Semtech Official SDK: Based on VS Code, this is the original factory SDK from Semtech. It provides more comprehensive features and is closer to the official implementation.

Both SDKs include source code for wireless data transmission and reception, along with configuration examples.

Q10: How should I handle antenna selection and layout?

A: Since the module has independent antenna interfaces for Sub-GHz and 2.4GHz, please note:

• Sub-GHz antenna: Choose an antenna matching your operating frequency (e.g., 433MHz, 470MHz, 868MHz, or 915MHz). For maximum range, use a quarter-wave whip antenna or a high-gain directional antenna.

• 2.4GHz antenna: Use a standard 2.4GHz antenna (e.g., 2.4GHz whip, PCB antenna, or ceramic antenna).

• Isolation: Maintain sufficient physical separation between the two antennas to minimize mutual coupling. A separation of at least λ/4 at the lower frequency is recommended.

• Ground plane: Ensure a solid ground plane underneath the module and antenna feed points.

Q11: Can the module be used for satellite communication?

A: The LR2021 chip itself supports S-band (1900-2200MHz) for satellite communication (SATCOM). However, the E80-xxxM2212S modules as currently specified focus on Sub-GHz and 2.4GHz ISM bands. For satellite communication applications, please consult EBYTE for specific module variants and antenna requirements.

Q12: What certifications does this product have?

A: EBYTE products strictly use lead-free production processes and comply with RoHS and REACH standards. The modules undergo rigorous testing to ensure batch consistency and reliability. For specific regional certifications (FCC, CE, etc.), please contact EBYTE directly for the latest certification status.

Q13: How does the LR2021 compare with previous generation LoRa chips?

A: The following table summarizes the key differences across four generations of Semtech LoRa IP:

Q14: Can I use this module as a drop-in replacement for SX1262 or SX1276 in my existing design?

A: While the LR2021 is backward compatible at the LoRa protocol level, it is not pin-compatible with SX1262 or SX1276. A hardware redesign of the PCB is required. However, the SPI register map has been designed to minimize software migration effort. Semtech provides migration guides and the EBYTE E80_DEMO SDK can serve as a reference for porting.

Q15: What is the module's package and how should it be soldered?

A: The module uses a stamp-hole SMD package with dimensions of 26.0 × 16.0 × 3.0mm. It is designed for reflow soldering. EBYTE recommends following standard lead-free reflow soldering profiles. The module's edge castellations provide reliable solder joints and allow for visual inspection after soldering.

E80 series dual-band LoRa modules (E80-xxxM2212S) and evaluation kits (E80-xxxMBL-02) represent a new trend in wireless communication — driving both Sub-GHz and 2.4GHz frequency bands through a single chip, perfectly solving the pain point of IoT multi-band integration. The core modules, with their ultra-compact size and dual-band capability, reduce mass production costs. The evaluation kits provide developers with an "out-of-the-box" rapid prototyping platform, accelerating product time-to-market. Whether you are developing smart meters, industrial sensors, agricultural IoT devices, or smart home gateways, the E80 series offers a future-proof, cost-effective dual-band wireless solution.