As an enterprise deeply rooted in the IoT communication field, Chengdu Ebyte Electronic Technology Co., Ltd. (EBYTE) has a product line covering a wide range of categories from wireless modules to industrial computing core boards. One of the keys to its success lies in the in-depth cooperation with world-leading chip manufacturers, and the development of high-performance, stable and reliable products based on these top-tier chip solutions. This article systematically sorts out the main chip solutions adopted in EBYTE's products, deeply analyzes the characteristics of each chip, and explains the reasons behind EBYTE's selection.
Wireless Communication Chip Solutions: Diverse Technologies Covering Full-Scenario Connectivity
Wireless modules are EBYTE's core business, with product lines covering LoRa, Wi-Fi, BLE, ZigBee, NB-IoT and other technologies. The selected chip solutions present the characteristics of diversification and high specifications.
LoRa Spread Spectrum Chips: Dual Drive of Semtech and Domestic Alternatives
Semtech SX1262 / SX1268
Chip Introduction: The SX1262 (for 868/915MHz) and
SX1268 (for 433/470MHz) from Semtech are a new generation of LoRa RF
chips. Compared with the previous generation SX1278/76 series, they
feature lower power consumption, faster speed and smaller size.
Functional Features:
Adopts LoRa spread spectrum modulation technology with extremely strong anti-interference capability, and the receiving sensitivity can reach -148dBm.
Supports multiple modulation modes (LoRa, GFSK, FSK).
Built-in PA+LNA (Power Amplifier and Low Noise Amplifier), which can achieve a maximum transmit output of 2W (33dBm) or even higher.
Applicable Models: E22-400M30S, E22-900M33S, E22-400T33S, E22-900T37S, etc.
Selection Rationale: As the pioneer of LoRa technology, Semtech chips represent the highest level in the industry. EBYTE chooses the SX126X series to achieve top-level performance in communication distance, power consumption control and anti-interference, meeting the requirements of medium and long-distance, high-reliability industrial IoT applications.
Semtech LLCC68
Chip Introduction: LLCC68 is another LoRa chip
launched by Semtech, which can be regarded as a simplified or economic
version of the SX126X series, focusing on the Sub-GHz frequency band.
Functional Features: Also supports LoRa and (G)FSK
modulation, but the upper limit of transmit power is relatively low
(usually 22dBm), with smaller size and better cost performance.
Applicable Models: E220-400M22S, E220-900M22S, E220-400M30S, E220-230T30S, etc.
Selection Rationale: EBYTE adopts LLCC68 mainly to
balance performance and cost. For scenarios where the communication
distance requirement is not extreme, but high cost-effectiveness and
mass application are pursued (such as smart home, sensor network),
LLCC68 provides the optimal solution.
Domestic PANCHIP PAN3031 / PAN3060
Chip Introduction: PAN3031 and PAN3060 are domestic
ChirpIoT™ spread spectrum chips launched by Shanghai PANCHIP
Microelectronics, realizing the domestic substitution of LoRa-like
technology.
Functional Features: Adopts innovative ChirpIoT™ spread
spectrum technology, with high anti-interference and high sensitivity
characteristics; compatible with LoRa instruction set and supports
multiple working modes.
Applicable Models: E29-400T22S (PAN3031), E290-xxxTxxS series (PAN3060), etc.
Selection Rationale: EBYTE's choice of domestic chip
solutions reflects its response to supply chain security and national
strategies. On the premise of ensuring performance close to
international brands, it provides better cost and more flexible
customized services to meet projects with requirements for localization
of core devices.
Wi-Fi/BLE Combo Chips
ESP32 Series
Chip Introduction: The ESP32 series is a dual-core
MCU chip integrating Wi-Fi and Bluetooth functions launched by Espressif
Technology. EBYTE widely adopts models such as ESP32-D0WD-V3, ESP32-C3,
ESP32-C6, ESP32-S3, etc.
Functional Features:
ESP32-D0WD-V3: Dual-core LX6 processor with 240MHz main frequency, integrated Wi-Fi and classic Bluetooth/BLE, with strong performance.
ESP32-C3: Single-core RISC-V 32-bit processor, safe and reliable, supports Wi-Fi and BLE 5.0, with high cost-effectiveness.
ESP32-C6: Supports Wi-Fi 6 and BLE 5.3, providing faster speed, lower power consumption and stronger anti-interference capability.
ESP32-S3: Integrated neural network processor, providing strong AI computing power, suitable for AIoT edge computing scenarios.
Applicable Models: E101-32WN4, E101-C3MN4, E101-C6MN4, E101-S3WN8 series, etc.
Selection Rationale: Espressif chips have an extremely complete ecosystem and active community, with low development threshold. Most modules developed by EBYTE based on these chips support the AT instruction set, allowing engineers without Wi-Fi/BLE development experience to quickly realize product networking. At the same time, its rich product line covers all needs from entry-level to high-end.
Texas Instruments (TI) Wi-Fi Chips
Chip Introduction: TI provides high-performance, high-reliability Wi-Fi chip solutions, such as CC3235S, CC3301, etc.
Functional Features:
CC3235S: Supports dual-band (2.4/5GHz) Wi-Fi, built-in powerful ARM Cortex-M4 processor and encryption engine, with extremely high security and reliability.
CC3301: TI's 10th generation Combo chip, supports Wi-Fi 6 and BLE 5.4, with excellent performance, suitable for seamless integration with TI's own processors.
Applicable Models: E103-W06 (CC3235S), E103-W13 (CC3301).
Selection Rationale: The advantages of TI chips lie in industrial-grade reliability, high security and stable supply. EBYTE chooses TI solutions to meet the demanding industrial and high-end applications with strict requirements for data security and long-term stable operation, such as medical, financial, key infrastructure, etc.
BLE Bluetooth Chips: Complementarity of Nordic and Dialog
Chip Introduction: EBYTE widely adopts chips such as nRF52832, nRF52833, nRF52840 from Nordic Semiconductor.
Functional Features: Supports BLE 4.2/5.0/5.1,
high-performance ARM Cortex-M4 core, supports multiple protocols (BLE,
ANT, Thread, Zigbee), with rich resources.
Applicable Models: E73-2G4M04S1F, E73-2G4M08S1E, E73-2G4M08S1C, etc.
Selection Rationale: The nRF52 series is the "star
chip" in the BLE field, famous for its ultra-low power consumption,
powerful processing performance and rich ecosystem. EBYTE uses it to
build high-end, multi-functional BLE modules that require secondary
development.
Chip Introduction: EBYTE also adopts chips such as DA14531, DA14535 from Dialog Semiconductor.
Functional Features: Focuses on BLE 5.0/5.3, with
extremely small chip size and ultra-low power consumption, supports
master-slave integration and transparent transmission function.
Applicable Models: E104-BT52 series.
Selection Rationale: The advantages of Dialog chips lie
in the extreme size and power consumption, as well as highly integrated
features. EBYTE uses it to build ultra-small, cost-sensitive,
ready-to-use BLE transparent transmission modules to meet the needs of
wearable devices, beacons and other markets.
NB-IoT Chip: Xinyi Technology XY1100
Chip Introduction: The XY1100 developed by Xinyi Technology is the world's first mass-produced NB-IoT chip with single-Die integrated CMOS PA.
Functional Features: Integrated dual-core processor
(ARM core + DSP core), equipped with Huawei LiteOS, supports multiple
power consumption modes, and the deep sleep power consumption is as low
as 0.7uA. Combined with GK9501, it can also realize NB+GPS/Beidou
positioning.
Applicable Models: EA01-S (XY1100), EA01-SG (XY1100+GK9501).
Selection Rationale: EBYTE chooses Xinyi Technology's
solution mainly because of its world-leading integration (single-Die
integrated CMOS PA) and ultra-low power consumption characteristics. At
the same time, it actively responds to the call of domestic
substitution, providing a cost-effective and high-stability NB-IoT
connection solution for massive IoT (mMTC) scenarios.
Industrial Computing Chip Solutions: Full Spectrum of Computing Power from Entry Level to AI
EBYTE's industrial computing product line (core boards, single-board computers) adopts processors from different brands and architectures, forming a clear performance grading.
1. Entry Level: ARM Cortex-A7
Adopted Chips: STMicroelectronics (ST) STM32MP135 series, NXP i.MX6ULL.
Chip Features: Single-core or dual-core ARM Cortex-A7,
main frequency 650MHz-1GHz, providing entry-level computing power for
running Linux systems.
Functional Features: Integrated rich industrial interfaces (UART, CAN, SPI, I2C), supports multiple Ethernet and display interfaces.
Representative Products: ECK10-13xA series, ECK20-6Y28C series.
Selection Rationale: High ecological maturity, rich
documentation and perfect technical support. As an entry-level choice
for Linux application processors, it perfectly replaces traditional MCUs
and realizes system intelligence at extremely low cost and power
consumption.
2. Mid-range Mainstream: ARM Cortex-A55 / A35
Adopted Chips: Allwinner Technology T113-i, Rockchip RK3506.
Chip Features: Dual-core or quad-core Cortex-A7/A35/A55, main frequency 1.0-1.5GHz, with stronger processing capability.
Functional Features: Has stronger graphics processing
capability and multimedia codec capability, supports smooth HMI
interface and complex network protocols.
Representative Products: ECK30-T13I series, ECK41-E series.
Selection Rationale: Fully domestic, high
cost-effectiveness and small size. With these chips, EBYTE expands the
mid-range market and provides a balanced computing core for HMI,
gateways, smart terminals, etc.
3. High-end Flagship: Edge AI with Integrated NPU
Adopted Chips: Allwinner Technology T527, Rockchip RK3506G2, Amlogic and other high-end platforms.
Chip Features: Multi-core (six/eight-core) ARM
Cortex-A55, integrated advanced NPU (Neural Processing Unit), with
computing power up to 2 TOPS or higher.
Functional Features: Specially designed for edge AI
applications, it can realize high computing power requirements such as
real-time image recognition and voice analysis with extremely low power
consumption.
Representative Products: ECK32-T527 series.
Selection Rationale: Keep up with the development trend
of AIoT. EBYTE launches core boards with NPU to empower customers to
quickly deploy AI applications in cutting-edge fields such as smart
factories, intelligent security, and autonomous driving, realizing the
leap from "connection" to "intelligence".
III. Other Core Chip Solutions
RF Transceiver Chips: TI CC1101, CC1310, CC1312R are used in E07, E70 and other data radio modules to provide stable long-distance communication in the Sub-1GHz frequency band.
ZigBee Chips: TI CC2530 is used in E18 and other ZigBee modules to provide industry-standard ZigBee 3.0 ad-hoc network solutions.
Ethernet Chips: EBYTE's self-developed EBT3001 and EBT3002 chips, with built-in PHY and TCP/IP protocol stack, are used for serial to Ethernet servers.
Frequently Asked Questions (FAQ)
Q1: Does EBYTE provide customized services based on the above chip solutions?
A: Yes. EBYTE supports personalized customization for all series of modules and core boards, including parameter tuning, firmware modification, hardware pin redefinition, and protocol adaptation. For mass demand, it can also provide exclusive chip supply and joint R&D services.
Q2: Are EBYTE's domestic chip solutions fully compatible with international solutions?
A: For LoRa, Wi-Fi, BLE and other general protocol products, domestic chip solutions support standard protocol stacks, and most of them are compatible with the AT instructions of international chip versions, which can be directly replaced in most scenarios. For special customized functions, it is recommended to confirm with technical support in advance.
Q3: What is the typical supply cycle of EBYTE's chip solutions?
A: For conventional products based on Semtech, Espressif, Nordic and other mainstream chips, the standard supply cycle is 7-15 working days. For domestic chip series, the supply chain is more stable, and the mass supply cycle can be controlled within 10 working days, which is better than international chip solutions in the case of tight global chip supply.
Q4: Do EBYTE's core board products provide supporting development resources?
A: Yes. All core board products come with complete development materials, including schematic diagrams, PCB package libraries, Linux kernel source code, cross-compilation toolchains, and routine demos. For entry-level users, there are also supporting development boards and video tutorials to help get started quickly.
Q5: How to choose between LoRa solutions based on Semtech and domestic PANCHIP?
A: For projects that require the longest communication distance, the highest stability, and compatibility with existing LoRa private networks, the Semtech solution is preferred. For projects that require cost optimization, supply chain security, and domestic localization, the PANCHIP solution is more cost-effective, and its performance is close to that of Semtech's mid-range products in most scenarios.
Q6: Are EBYTE's Wi-Fi/BLE modules suitable for battery-powered scenarios?
A: For low-power scenarios, it is recommended to choose modules based on ESP32-C3, Nordic nRF52, or Dialog DA14531 chips. The sleep power consumption can be as low as 1-5uA, and the average power consumption in the periodic data reporting scenario can be controlled at the uA level, which can meet the requirement of 3-5 years of battery life.
Q7: What is the operating temperature range of EBYTE's industrial-grade chips?
A: All industrial-grade products based on TI, NXP, ST, and domestic industrial chips support the wide temperature range of -40°C to 85°C, and can pass strict tests such as ESD, surge, and vibration, meeting the requirements of harsh industrial environments.
EBYTE's Chip Selection
EBYTE does not rely on a single chip ecosystem, but builds an open, diverse and complementary chip cooperation system. Its selection decisions follow the following core logic:
Technology Leadership and Performance First: When benchmark products in a technical direction are required (such as long-distance LoRa, low-power BLE), the industry's top chips (Semtech, Nordic) are preferred.
Cost-effectiveness and Market Popularization: In order to cover a wider market and launch cost-effective "national-level" products, chip solutions with better cost (such as LLCC68, Espressif, domestic PANCHIP) will be selected.
Supply Chain Security and Localization: Actively respond to national strategies, cooperate deeply with excellent domestic chip manufacturers (Allwinner, Rockchip, Xinyi, PANCHIP), and provide customers with safe and reliable pure domestic solutions.
Ecological Integration and Usability: Prioritize chip platforms with large developer communities, complete toolchains and detailed documentation (such as Espressif, ST), making product development easier and faster for customers.
Industrial-grade Reliability and Long Lifespan: For industrial and mission-critical applications, priority is given to chip brands known for high reliability and long supply periods (such as TI, NXP).
Through such a three-dimensional selection strategy, EBYTE not only provides a strong "heart" for its huge product line, but also becomes a key bridge connecting top chip technology with thousands of IoT application scenarios, fulfilling its promise of "IoT Application Expert".
