| ECK20-6Y28C5E8-I |
MCIMX6Y2CVM08AB | 792M | 512 | 8G | 5 | BTB | 46*36*6.8 | -40~85 | Industrial-grade, low power consumption, high cost-effectiveness, high reliability, supports Linux and QT |
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| ECK33-BCE2E16-I |
T536MX-CEX | 1.6G | 2GB | 16GB | 5 | LGA | 45*43*3.5 | -40~+85 | High-performance quad-core A55 processor, multi-core heterogeneous ARM+RISC-V architecture, ECC protection, LPDDR4 memory, industrial-grade, and Linux support. |
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| ECK33-B2N4E32-I |
T536MX-CEN2 | 1.6GB | 4GB | 32GB | 5 | LGA | 45*43*3.5" | -40~+85 | High-performance quad-core A55, 2TOPS AI NPU, multi-core heterogeneous ARM+RISC-V, ECC protection, LPDDR4 memory, industrial-grade, Linux support |
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| ECK20-6Y28C5E8-C |
MCIMX6Y2CVM08AB | 792M | 512 | 8G | 5 | BTB | 46*36*6.8 | 0~70 | Low power consumption, high cost-effectiveness, high reliability, supports Linux and QT |
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| ECK20-6Y28C2N5-I |
MCIMX6Y2CVM08AB | 792M | 256 | 512 | 5 | BTB | 46*36*6.8 | -40~85 | Industrial-grade, low power consumption, cost-effective, high reliability, supports Linux and QT |
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| ECK30-T13IC1E8-I |
T113-i | 1.2G | 1G | 8G | 5 | BTB | 46*36*5.3 | -40~85 | Industrial-grade, domestically produced, multi-core heterogeneous architecture, cost-effective, high reliability |
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| ECK30-T13IC5E8-I |
T113-i | 1.2G | 512 | 8G | 5 | BTB | 46*36*5.3 | -40~85 | Industrial-grade, domestically produced high-performance, multi-core heterogeneous architecture, cost-effective, and highly reliable |
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| ECK30-T13IC2N2-I |
T113-i | 1.2G | 256 | 256 | 5 | BTB | 46*36*5.3 | -40~85 | Industrial-Grade, Domestically Produced High-Performance, Multi-Core Heterogeneous, High Cost-Effectiveness, High Reliability |
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| ECK32-T527B4E32-N |
T527M/MN | 1.8GB | 4GB | 32GB | 5.0 | LGA | 45*43*3.5 | -25~85 | High-performance octa-core A55, integrated GPU, multi-core heterogeneous ARM+RISC-V, LPDDR4 memory, wide temperature range, cost-effective, and Linux compatible. |
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| ECK32-T527B2E16-I |
T527M/MN | 1.8GB | 2GB | 16GB | 5.0 | LGA | 45*43*3.5 | -40~85" | High-performance octa-core A55 processor, integrated GPU, multi-core heterogeneous ARM+RISC-V architecture, LPDDR4 memory, industrial-grade, cost-effective, Linux compatible |
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| ECK32-T527BN4E32-N |
T527M/MN | 1.8GB | 4GB | 32GB | 5.0 | LGA | 45*43*3.5 | -25~85 | High-performance octa-core A55, 2TOPS AI NPU, integrated GPU, multi-core heterogeneous ARM+RISC-V, LPDDR4 memory, wide temperature range, Linux support |
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| ECK10-135D5E8-C |
STM32MP135DAF7 | 1G | 512 | 8GB | 5 | Gold fingers | 67.6*30*4.5 | 0⁓70 | High-reliability embedded core board, suitable for computing power control scenarios such as servers and gateways. The gold fingers are easily replaceable, and it features low power consumption. |
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| ECK10-135D2-C |
STM32MP135DAF7 | 1G | 256 | 0 | 5 | Gold fingers | 67.6*30*4.5 | 0⁓70 | High-reliability embedded core board, suitable for computing power control scenarios such as servers and gateways. Gold finger packaging facilitates replacement. Low power consumption. |
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| ECK32-T527BN4E32-I |
T527M/MN | 1.8GB | 4GB | 32GB | 5.0 | LGA | 45*43*3.5 | -40~85 | High-performance octa-core A55, 2TOPS AI NPU, integrated GPU, multi-core heterogeneous ARM+RISC-V, LPDDR4 memory, industrial-grade, Linux support |
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| ECK10-131A2M2M-I |
STM32MP131AAF3 | 650M | 256 | 256 | 5 | Stamp hole | 38*32*3.1 | -40~+85 | Industrial control motherboard, high cost performance, high reliability, low power consumption |
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