[Communication distance]: 0.28km

[Packaging method]: Surface mount/stamp hole

[Dimensions]: 20.3*13.3*3mm

[Communication distance]: 0.28km

[Packaging method]: Surface mount/stamp hole

[Size]: 20.3*13.3*3mm

[Chip Solution]: -

[Operating Frequency]: 315MHz

[Transmit Power]: 12dBm

[Communication diatance]: 0.21km

[Size]: 12*7.5*2mm

[Product weight]: 1.85g

[Chip Solution]: -

[Operating Frequency:]: 315MHz

[Transmit Power]: 12dBm

[Communication diatance]: 0.21km

[Size]: 12*7.5*2mm

[Weight]: 1.85g

[Chip Solution]: -

[Operating Frequency]: 433MHz

[Transmit Power]: 13dBm

[Communication diatance]: 0.21km

[Dimensions]: 20.4*13.3*3mm

[Product weight]: 3.65g

[Chip Solution]: -

[Operating Frequency]: 315MHz

[Transmit Power]: 13dBm

[Communication diatance]: 0.21km

[Size]: 20.4*13.3*3mm

[Product weight]: 3.65g

[Chip Solution]: -

[Operating Frequency]: 433.92MHz

[Communication Interface]: GPIO

[Communication Distance]: 0.21km

[Size]: 12.0*8.5*2.5mm

[Product weight]: 1.85g

[Chip Solution]: -

[Operating Frequency]: 315MHz

[Communication Interface]: GPIO

[Communication Distance]: 0.21km

[Size]: 12.0*8.5*2.5mm

[Product weight]: 1.85g